KLS12-XFP-01 XFP 30Pos SMD Connector

Features:
Capable of 10Gbps data signal speeds 15 or 30-microinch gold plating. 
High-speed contact design. 
SMT design in tape reel or tray packaging. 
Advanced stamping technology for smooth contact surface.
Material：
Insulators：Polyester Thermoplastics Glass Fibre Filled, UL 94V-0 
Contact：Copper Alloy With Au Plated.
Electrical：
Contact Resistance：△R10 milliohms Max. for signal contacts 
Insulation Resistance：1000MΩ Min. Current Rating：0.5 Amps Max. per contact
Mechanical：
Transceiver Insertion Force：40N Max. 
Transceiver Extraction Force：30N Max. 
Durability：100 Cycles Min. 
Operating Temperature Range：-20°C to +85°C